Micron Memory Part Number Decoder -
This section tells you the total capacity and the architecture of the memory.
Translation: The "1G72" combined with the "S" (RDIMM) usually points to an 8GB or 16GB module depending on the specific chip density used on the stick.
If you see -40 anywhere in the suffix, that usually indicates -40°C operating range. Standard parts will not have that. For embedded systems, never substitute a commercial part for an industrial one.
| Field | Code | Meaning | |-------|------|---------| | MTA | Micron Module | | 18 | Module generation/density factor | | ADF | Module type (ADF = DDR4 RDIMM, ASF = SODIMM, etc.) | | 2G | Total module density (2GB per rank or total) | | 72 | Data width (72 bits = 64 + 8 ECC) | | AZ | PCB/configuration code | | -3G2E1 | Speed: 3G2 = DDR4-3200, E1 = specific timing/temperature |
This three-character field is critical:
S) = Voltage / VDD.
F) = Package / Component organization (often ignored in modules but refers to the DRAM package on the DIMM).Thus, ASF = Unbuffered, 1.2V, standard package.
Most Micron memory components (like DDR4, DDR5, LPDDR, NAND) follow a format like:
MTxxxxxxx_xx_xx_xxxx-xx
Below is the breakdown for DRAM components (the actual chips on a module).
| Code | DDR Generation | Speed (MT/s) | CAS Latency | |------|----------------|--------------|---------------| | -062E | DDR4 | 3200 | CL22 | | -075E | DDR4 | 2666 | CL19 | | -083E | DDR4 | 2400 | CL17 | | -093E | DDR4 | 2133 | CL15 | | -062F | DDR5 | 4800 | CL40 | | -046F | DDR5 | 5600 | CL46 |
If you have ever worked with hardware procurement, reverse engineering, or inventory management, you have likely encountered the "alphabet soup" stamped on a memory module. Micron Technology, one of the world’s largest memory manufacturers, uses a specific nomenclature to identify their DRAM components and modules.
While the string of characters looks cryptic at first glance, it follows a logical structure. This guide will help you decode a Micron part number (PN) to determine the density, speed, form factor, and package type without needing a datasheet.
The Micron memory part number decoder is a vital mental framework for anyone working with memory components. It transforms an opaque string like “MT40A1G16RC-062E:B” into actionable engineering data: DDR4, 16Gb density, x16 organization, 78-ball BGA, 3200 Mbps speed, industrial temperature capability, and revision B. By systematically parsing each field—prefix, family, density, organization, package, speed, and revision—one can quickly assess compatibility, performance, and reliability. In an industry where a single wrong component can delay a product launch by months, mastering the decoder is not just technical trivia; it is a professional necessity. As Micron continues to push into DDR5, LPDDR6, and 3D NAND with higher densities and new interfaces, the naming logic will evolve—but the principle of a structured, field-based decoder will remain the key to unlocking silicon identity.
Decoding a Micron memory part number reveals critical specs like technology (DDR4/DDR5), density, and speed grade. Because chips are often too small for full part numbers, they use a 5-digit FBGA code (e.g., D9VPP) that you must decode first. 1. Essential Decoding Tools
FBGA & Component Decoder: Enter the 5-digit code found on the physical chip to get the full "MT" part number.
DRAM Cross-Reference Tool: Compare specific Micron part numbers against competitors or find exact technical specs.
SPD Data Lookup: Get detailed timing and configuration data for a full module. 2. Standard Part Number Breakdown (DRAM)
Most Micron DRAM part numbers follow this pattern: MT [Technology] [Configuration] [Package] - [Speed] [Revision]. Common Codes Definition Technology 40 (DDR4), 60 (DDR5), 41 (DDR3) The generation of memory. Configuration 1G8 (8Gb x8), 512M16 (8Gb x16) Depth (density) and data bus width. Voltage A (1.2V), B (1.1V), K (1.35V) Operating voltage requirements. Speed Grade -062E (DDR4-3200), -075 (DDR4-2666) Max frequency and timing (CL-tRCD-tRP). Die Revision :E, :B, :A The specific manufacturing "generation" or "die". 3. Key Suffixes & Markings FBGA and part decoder | Micron Technology Inc.
This section tells you the total capacity and the architecture of the memory.
Translation: The "1G72" combined with the "S" (RDIMM) usually points to an 8GB or 16GB module depending on the specific chip density used on the stick.
If you see -40 anywhere in the suffix, that usually indicates -40°C operating range. Standard parts will not have that. For embedded systems, never substitute a commercial part for an industrial one.
| Field | Code | Meaning | |-------|------|---------| | MTA | Micron Module | | 18 | Module generation/density factor | | ADF | Module type (ADF = DDR4 RDIMM, ASF = SODIMM, etc.) | | 2G | Total module density (2GB per rank or total) | | 72 | Data width (72 bits = 64 + 8 ECC) | | AZ | PCB/configuration code | | -3G2E1 | Speed: 3G2 = DDR4-3200, E1 = specific timing/temperature |
This three-character field is critical:
S) = Voltage / VDD.
F) = Package / Component organization (often ignored in modules but refers to the DRAM package on the DIMM).Thus, ASF = Unbuffered, 1.2V, standard package.
Most Micron memory components (like DDR4, DDR5, LPDDR, NAND) follow a format like:
MTxxxxxxx_xx_xx_xxxx-xx
Below is the breakdown for DRAM components (the actual chips on a module). micron memory part number decoder
| Code | DDR Generation | Speed (MT/s) | CAS Latency | |------|----------------|--------------|---------------| | -062E | DDR4 | 3200 | CL22 | | -075E | DDR4 | 2666 | CL19 | | -083E | DDR4 | 2400 | CL17 | | -093E | DDR4 | 2133 | CL15 | | -062F | DDR5 | 4800 | CL40 | | -046F | DDR5 | 5600 | CL46 |
If you have ever worked with hardware procurement, reverse engineering, or inventory management, you have likely encountered the "alphabet soup" stamped on a memory module. Micron Technology, one of the world’s largest memory manufacturers, uses a specific nomenclature to identify their DRAM components and modules.
While the string of characters looks cryptic at first glance, it follows a logical structure. This guide will help you decode a Micron part number (PN) to determine the density, speed, form factor, and package type without needing a datasheet.
The Micron memory part number decoder is a vital mental framework for anyone working with memory components. It transforms an opaque string like “MT40A1G16RC-062E:B” into actionable engineering data: DDR4, 16Gb density, x16 organization, 78-ball BGA, 3200 Mbps speed, industrial temperature capability, and revision B. By systematically parsing each field—prefix, family, density, organization, package, speed, and revision—one can quickly assess compatibility, performance, and reliability. In an industry where a single wrong component can delay a product launch by months, mastering the decoder is not just technical trivia; it is a professional necessity. As Micron continues to push into DDR5, LPDDR6, and 3D NAND with higher densities and new interfaces, the naming logic will evolve—but the principle of a structured, field-based decoder will remain the key to unlocking silicon identity. This section tells you the total capacity and
Decoding a Micron memory part number reveals critical specs like technology (DDR4/DDR5), density, and speed grade. Because chips are often too small for full part numbers, they use a 5-digit FBGA code (e.g., D9VPP) that you must decode first. 1. Essential Decoding Tools
FBGA & Component Decoder: Enter the 5-digit code found on the physical chip to get the full "MT" part number.
DRAM Cross-Reference Tool: Compare specific Micron part numbers against competitors or find exact technical specs.
SPD Data Lookup: Get detailed timing and configuration data for a full module. 2. Standard Part Number Breakdown (DRAM) F: Voltage/Timing identifier (often varies by generation)
Most Micron DRAM part numbers follow this pattern: MT [Technology] [Configuration] [Package] - [Speed] [Revision]. Common Codes Definition Technology 40 (DDR4), 60 (DDR5), 41 (DDR3) The generation of memory. Configuration 1G8 (8Gb x8), 512M16 (8Gb x16) Depth (density) and data bus width. Voltage A (1.2V), B (1.1V), K (1.35V) Operating voltage requirements. Speed Grade -062E (DDR4-3200), -075 (DDR4-2666) Max frequency and timing (CL-tRCD-tRP). Die Revision :E, :B, :A The specific manufacturing "generation" or "die". 3. Key Suffixes & Markings FBGA and part decoder | Micron Technology Inc.
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